AutoWafer Pro™: Ultrasonic Equipment for NDT of Bonded Wafers
SONIX AutoWafer Pro™ 是專為全自動晶圓檢測設(shè)計的機(jī)型，主要應(yīng)用在Bond wafer，MEMS 內(nèi)部空洞、離層檢測，TSV量測方面。
● 使用于200和300mm晶圓
● 符合一級凈化間標(biāo)準(zhǔn)
● Cassette裝載，全自動檢測，支持FOUP或FOSB機(jī)械臂
● 支持200mm & 300mm SECS/GEM協(xié)議
● KLARF輸出文件
AutoWafer pro is our most advanced ultrasonic equipment for detecting defects in bonded wafers in a production environment, providing fast, high-resolution scanning of 200mm and 300mm bonded wafers.
A flexible, automated wafer inspection system designed for production, AutoWafer Pro provides fast, high-resolution scanning of 200mm and 300mm bonded wafers. It’s the ideal ultrasonic equipment for identifying bond defects in wafer applications such as MEMS, BSI Sensors, CMOS, memory, TSV and LED.
With extensive analysis capabilities at both the wafer and device level, there’s no need to reload and rescan wafers to get all the diagnostic images you need. And with high-speed scanning managed by fully automated wafer handling, AutoWafer Pro supports 100% nondestructive testing (NDT) for improved yields and a faster time to market.
- The ideal ultrasonic equipment for detecting wafer-to-wafer bonding defects
- A fully automated, production-ready wafer inspection system for MEMS, CMOS, BSI sensors, memory, TSV, LED and other applications employing wafers 200mm and smaller
- Provides wafer map with die-level pass/fail indicators (optional)
- Provides analysis (optional)
- 200mm SECS/GEM
- TSV entrenched metrology
- Fast, high-resolution scanning of 200mm and 300mm wafers for production environments
- Fully automated robotics using open cassettes, SMIF Pod, FOUPs or FOSB handling
- Class 1 clean room compliant, with integrated HEPA filter
- 300mm SECS/GEM (optional)
- KLARF compatible (optional)
